
Lohith Kumar Rekapalli Naga
3DIC Advanced Packaging Design Flow developer
lohith-rekapalli
Cupertino, California, United States
Joined March 2026
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Summary
Experienced in physical design and EDA, including work on 3DIC advanced packaging design flow at Siemens EDA and prior physical design roles at Intel and SumedhaIT. contactout
Pursuing graduate-level training in Electrical and Computer Engineering (Portland State University, 2023–2025) following a strong undergraduate foundation in electronics and communications.
Early-career experience spans both semiconductor physical design and gaming quality assurance, indicating technical versatility across engineering roles.
Engaged in student activities (listed as a candidate for a Student Finance Committee position), showing involvement in campus governance or student organizations. instagram
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