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Gaurav Gupta

Gaurav Gupta

VP Analyst covering semiconductors, AI analytics and emerging compute

gaurav-kumar-5700
Charlotte, North Carolina
Joined February 2026
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Summary

Senior industry analyst focused on the semiconductor manufacturing and design value chain, with research covering capital spending, wafer fab equipment, advanced process technologies, AI analytics in manufacturing and design, chip industry economics, and emerging compute paradigms. gartner+2
Technically trained materials scientist and published researcher (Ph.D.) with a record of academic publications on high-temperature materials, creep, corrosion and grain-boundary engineering, particularly work on ferritic-martensitic alloy T91. google+2
Public commentator and speaker on semiconductor market trends and technology — quoted in media on chip-market forecasts and seen presenting at industry events; serves as a vendor lead analyst role (Nvidia) within Gartner. forbes+3
Experienced across industry and consulting: moved from technical roles in the semiconductor industry (including GLOBALFOUNDRIES and earlier technical experience at Intel and IBM) into consulting at McKinsey, then into research and advisory leadership at Gartner. rocketreach+2

Work

Education

Writing

Ph.D. Thesis: Role of a thermo-mechanical treatment on the subgrain boundary density and on creep behavior of ferritic-martensitic alloy T91

January 1, 2007

Doctoral thesis investigating the effects of thermo-mechanical processing on subgrain boundary density and subsequent impacts on high-temperature creep behavior of T91 alloy.

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Improved Creep Properties of Grain Boundary Engineered 9Cr-1Mo-Nb-V (T91) steel

January 1, 2006

Work reporting improved creep behavior in T91 steel linked to grain boundary engineering and subgrain boundary density modifications.

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Grain boundary engineering of ferritic-martensitic alloy T91

January 1, 2004

Study on grain boundary engineering approaches applied to ferritic-martensitic alloy T91, addressing microstructural influences on properties relevant to high-temperature creep and corrosion behavior.

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